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ammp-5024 30khz C 40 ghz traveling wave amplifer data sheet pin connections (top view) description avago technologies ammp-5024 is a broadband phemt gaas mmic twa designed for medium output power and high gain over the full 30 khz to 40 ghz frequency range. the design employs a 9-stage, cascade-connected fet structure to ensure fat gain and power as well as uniform group delay. e-beam lithography is used to produce uniform gate lengths of 0.15um and mbe technology assures precise semiconductor layer control. features ? surface mount package 5.0 x 5.0 x 2.0 mm ? wide frequency range 30khz C 40ghz ? high gain: 14.8 db typical @ 22ghz ? output p1db: 22 dbm typical @ 22ghz ? 50 ohm input and output match applications [1] ? broadband test and measurement applications notes: 1. use in hermetic assemblies only. table 1. absolute maximum ratings [1] symbol parameters and test conditions unit minimum maximum v dd positive drain voltage v - 10 i dd total drain current ma - 380 v g1 first gate voltage v -9.5 0 i g1 first gate current ma -38 1 v g2 second gate voltage v -3.5 4 i g2 second gate current ma -20 - p in cw input power dbm - 17 t ch operating channel temperature c - +150 t stg storage case temperature c -65 +150 t max maximum assembly temperature (20 sec max) c - +260 note: 1. operation in excess of any one of these conditions may result in permanent damage to this device. the absolute maximum ratings for dc and power parameters were determined at an ambient temperature of 25c unless noted otherwise. pin function 1 v aux 2 not used 3 not used 4 rf out / vdd 5 v g1 6 not used 7 v g2 8 rf in rohs-exemption please refer to hazardous substances table on page 11. attention: observe precautions for handling electrostatic sensitive devices. esd machine model (class a): 40v esd human body model (class 0): 50v refer to avago application note a004r: electrostatic discharge damage and control.
table 2. dc specifcations (v dd = 7v, v g2 = open, t a = 25 c, otherwise specifed) symbol parameters and test conditions unit minimum typical maximum v dd recommended drain supply voltage v - 7 - i dd total drain supply current (v g1 set for typical i dd ) ma - 200 - v g1 first gate voltage (v dd = 7v, i dd = 200ma) v -3.5 -3.0 -2.5 i dss saturated drain current (v g1 = 0v) ma - 350 - i dsmin (v g1 ) first gate minimum drain current (v g1 = -7v) ma - 80 - q ch-b thermal resistance [1] c/w - 16.2 - note: 1. channel-to-board thermal resistance is measured using qfi method. table 3. rf specifcations [1] (freq = 22ghz, v dd = 7v, i dd = 200ma, t a = 25c, zin = zo = 50ohm) symbol parameters and test conditions unit minimum typical maximum gain small signal gain [2] db 12.5 14.8 16.5 iso reverse isolation db - 30 - rlin input return loss db - 13 - rlout output return loss db - 14 - nf noise figure db - 4.6 - p1db output power at 1db gain compression dbm - 22 - oip3 output 3 rd order intercept point [3] dbm - 25 - notes: 1. specifcations are derived from measurements in a 50 ohm test environment. aspects of the amplifer performance may be improved over a narrower bandwidth by application of additional conjugate, linearity, or low noise matching. 2. all tested parameters guaranteed with measurement accuracy 0.5 db for gain. 3. rfin1 = rfin2 = -5 dbm, freq = 22ghz, d f = 100mhz table 4. rf specifcations [1] (freq = 22ghz, v dd = 4v, i dd = 160ma, t a = 25c, zin = zo = 50ohm) symbol parameters and test conditions unit minimum typical maximum gain small signal gain db - 15 - iso reverse isolation db - 27 - rlin input return loss db - 13 - rlout output return loss db - 14 - nf noise figure db - 4.6 - p1db output power at 1db gain compression dbm - 19 - oip3 output 3rd order intercept point [3] dbm - 18.5 - notes: 1. specifcations are derived from measurements in a 50 ohm test environment. aspects of the amplifer performance may be improved over a narrower bandwidth by application of additional conjugate, linearity, or low noise matching. 2. rfin1 = rfin2 = -5 dbm, freq = 22ghz, d f = 100mhz
3 figure 1. gain and rev erse isolation . f igure 2. return loss (input and output). frequenc y ( ghz) gain (db ) isola tion (db ) 0 20 10 0 -10 -20 0 -20 -40 -60 -80 40 5 2 5 3 0 15 10 20 35 5 2 5 3 0 15 10 20 35 s21 s12 figure 3. output p ower (p1db and p3db) . f igure 4. output ip3 . frequenc y ( ghz) output power (dbm) 0 30 25 20 15 10 5 0 40 figure 5. noise figure. frequenc y ( ghz) return l oss (db ) 0 0 -5 -10 -15 -20 -25 -30 -35 -40 40 5 2 5 3 0 15 10 20 35 s11 s22 p1db p3db 5 2 5 3 0 15 10 20 35 frequenc y ( ghz) nf (db) 0 10 8 6 4 2 0 40 0 10 20 30 40 50 0 5 10 15 20 25 30 35 40 frequency (ghz) oip3 (dbm) ammp-5024 typical performance (v dd = 7v, i dd = 200ma, v g2 = open, t a = 25c, zin = zo = 50ohm)
4 ammp-5024 typical scattering parameters (v dd = 7v, i dd = 200ma, t a = 25c, zin = zo = 50ohm) freq. s 11 s 21 s 12 s 22 ghz db mag ang db mag ang db mag ang db mag ang 0.05 -25.978 0.050 173.710 16.186 6.446 174.640 -72.335 0.000 141.290 -26.454 0.048 -42.740 1 -26.744 0.046 117.220 15.721 6.110 100.990 -58.370 0.001 -165.550 -33.252 0.022 -90.950 2 -26.571 0.047 61.340 15.557 5.996 24.710 -53.860 0.002 -99.050 -23.888 0.064 -155.950 3 -26.930 0.045 12.940 15.263 5.797 -52.010 -49.134 0.004 15.990 -17.895 0.127 115.270 4 -29.254 0.035 6.460 15.395 5.885 -129.670 -47.270 0.004 55.720 -14.298 0.193 33.330 5 -19.848 0.102 -6.580 15.123 5.704 155.170 -44.616 0.006 -127.830 -12.123 0.248 -39.310 6 -14.255 0.194 -58.160 14.695 5.429 78.790 -42.263 0.008 158.680 -12.138 0.247 -104.940 7 -11.138 0.277 -115.080 14.510 5.315 3.360 -40.891 0.009 85.780 -14.387 0.191 -159.490 8 -10.433 0.301 179.950 15.543 5.335 -71.300 -39.546 0.011 13.470 -18.374 0.121 153.100 9 -12.506 0.237 104.570 14.512 5.316 -147.300 -38.049 0.013 -57.350 -35.109 0.018 124.870 10 -17.570 0.132 5.780 14.440 5.272 137.020 -37.511 0.013 -135.610 -22.144 0.078 -172.790 11 -17.725 0.130 -99.610 14.711 5.439 59.010 -36.835 0.014 152.110 -24.802 0.058 116.650 12 -14.873 0.180 173.320 14.513 5.317 -20.030 -36.316 0.015 77.930 -23.867 0.064 174.450 13 -13.815 0.204 100.170 15.232 5.148 -97.380 -35.782 0.016 6.700 -15.395 0.170 94.380 14 -12.745 0.231 25.400 13.791 4.893 -172.930 -35.242 0.017 -69.860 -12.660 0.233 -3.190 15 -10.716 0.292 -51.690 13.598 4.785 110.940 -34.507 0.019 -139.850 -11.701 0.260 -99.380 16 -8.667 0.369 -128.150 13.624 4.800 32.800 -34.278 0.019 145.780 -13.556 0.210 175.490 17 -7.590 0.417 153.760 14.037 5.034 -43.060 -33.476 0.021 70.520 -20.200 0.098 118.490 18 -8.199 0.389 74.850 13.957 4.987 -120.390 -32.375 0.024 -5.160 -19.304 0.108 138.190 19 -10.463 0.300 -1.090 14.036 5.033 161.010 -31.781 0.026 -85.970 -13.297 0.216 71.230 20 -12.461 0.238 -78.400 14.291 5.183 81.230 -31.169 0.028 -162.750 -11.796 0.257 -24.200 21 -13.659 0.208 -165.110 14.069 5.052 -2.200 -30.415 0.030 116.180 -13.161 0.220 -149.100 22 -12.899 0.227 116.340 13.220 4.582 -82.050 -30.291 0.031 35.000 -13.817 0.204 65.510 23 -10.155 0.311 34.530 13.003 4.468 -157.240 -29.612 0.033 -39.830 -11.899 0.254 -33.300 24 -8.977 0.356 -42.090 13.722 4.854 126.770 -30.071 0.031 -110.330 -11.948 0.253 -129.100 25 -8.885 0.360 -126.570 13.578 4.774 50.130 -28.925 0.036 174.660 -16.071 0.157 132.130 26 -10.631 0.294 125.640 14.768 5.475 -33.080 -28.294 0.039 88.570 -31.606 0.026 -122.730 27 -12.342 0.242 22.190 15.031 5.643 -122.180 -28.914 0.036 15.030 -11.365 0.270 112.700 28 -11.834 0.256 -49.790 14.375 5.233 159.050 -28.375 0.038 -65.960 -6.919 0.451 12.770 29 -10.876 0.286 -119.600 13.914 4.963 72.680 -28.988 0.036 -143.090 -8.057 0.396 -88.900 30 -15.263 0.173 132.230 13.992 5.008 -13.290 -28.236 0.039 135.300 -19.323 0.108 78.600 31 -20.051 0.099 11.090 13.096 4.517 -97.250 -28.635 0.037 48.910 -8.293 0.385 -54.660 32 -8.785 0.364 -45.770 12.628 4.279 -176.240 -29.742 0.033 -34.570 -7.399 0.427 -121.060 33 -4.750 0.579 -131.440 13.436 4.697 104.860 -29.755 0.033 -104.760 -11.404 0.269 -171.520 34 -9.580 0.332 158.370 13.170 4.555 10.340 -30.895 0.029 154.650 -13.866 0.203 -149.510 35 -13.936 0.201 78.060 11.457 3.740 -67.360 -35.014 0.018 79.650 -9.981 0.317 133.420 36 -16.029 0.158 -43.060 13.131 4.535 -153.950 -32.535 0.024 -6.350 -9.601 0.331 -8.060 37 -11.205 0.275 -128.410 12.777 4.354 115.460 -34.865 0.018 -102.940 -8.479 0.377 -142.750 38 -7.265 0.433 159.220 13.000 4.467 23.260 -33.033 0.022 154.830 -12.795 0.229 111.160 39 -5.714 0.518 58.020 13.086 4.511 -75.620 -31.534 0.027 87.970 -17.081 0.140 -48.940 40 -5.580 0.526 -52.120 11.090 3.585 -179.700 -34.663 0.019 -5.950 -15.054 0.177 -87.100 notes: 1. s-parameters are measured on r&d evaluation board with 50 ohm traces at input and output. efects of connectors and board traces are
5 figure 6. gain and rev erse isolation . f igure 7. return loss (input and output). frequenc y ( ghz) gain (db ) isola tion (db ) 0 20 10 0 -10 -20 0 -20 -40 -60 -80 40 5 2 5 3 0 15 10 20 35 5 2 5 3 0 15 10 20 35 s21 s12 figure 8. output p ower (p1db and p3db) . f igure 9. output ip3 . frequenc y ( ghz) output power (dbm) 0 30 25 20 15 10 5 0 40 figure 10. noise figure. frequenc y ( ghz) return l oss (db ) 0 0 -5 -10 -15 -20 -25 -30 -35 -40 40 5 2 5 3 0 15 10 20 35 s11 s22 p1db p3db 5 2 5 3 0 15 10 20 35 frequenc y ( ghz) nf (db) 0 10 8 6 4 2 0 40 0 10 20 30 40 50 0 5 10 15 20 25 30 35 40 frequency (ghz) oip3 (dbm) ammp-5024 typical performance (v dd = 4v, i dd = 160ma, v g2 = open, t a = 25c , zin = zo = 50ohm)
ammp-5024 typical scattering parameters (vdd = 4v, idd = 160ma, ta = 25c, zin = zo = 50ohm) freq. s11 s21 s12 s22 ghz db mag ang db mag ang db mag ang db mag ang 0.05 -25.975 0.050 174.630 16.479 6.667 174.400 -51.615 0.003 -169.010 -27.959 0.040 -50.830 1 -28.128 0.039 108.030 16.018 6.323 101.970 -60.865 0.001 -171.660 -39.098 0.011 -114.170 2 -30.831 0.029 64.310 15.889 6.229 26.560 -54.525 0.002 95.150 -26.428 0.048 -156.480 3 -28.241 0.039 46.520 15.628 6.045 -49.400 -50.773 0.003 5.870 -19.381 0.107 116.080 4 -24.184 0.062 16.640 15.754 6.133 -126.150 -49.843 0.003 -61.360 -15.352 0.171 35.680 5 -18.702 0.116 -19.780 15.503 5.959 159.420 -46.321 0.005 -136.060 -12.753 0.230 -34.710 6 -14.730 0.183 -65.590 15.125 5.705 83.920 -43.909 0.006 150.930 -12.234 0.245 -98.940 7 -11.826 0.256 -116.980 14.965 5.601 9.010 -42.439 0.008 78.940 -13.687 0.207 -154.490 8 -10.975 0.283 -179.330 15.037 5.648 -64.980 -41.144 0.009 8.470 -17.208 0.138 152.170 9 -12.836 0.228 106.430 15.001 5.624 -140.110 -39.341 0.011 -63.760 -32.601 0.023 98.900 10 -17.716 0.130 4.850 14.909 5.565 144.780 -39.078 0.011 -142.980 -22.939 0.071 -170.310 11 -17.651 0.131 -103.900 15.229 5.774 67.790 -38.247 0.012 145.670 -25.802 0.051 120.520 12 -14.886 0.181 168.360 15.064 5.665 -10.380 -37.729 0.013 71.210 -22.851 0.072 175.400 13 -14.513 0.196 93.980 14.860 5.534 -86.830 -37.172 0.014 2.890 -15.068 0.177 93.210 14 -13.644 0.208 20.670 14.476 5.294 -161.820 -36.737 0.015 -76.640 -12.603 0.234 -3.800 15 11.754 0.258 -52.750 14.332 5.207 122.500 -36.010 0.016 -144.320 -11.888 0.255 -99.180 16 -9.429 0.338 -125.910 14.399 5.248 44.800 -35.110 0.018 141.280 -13.870 0.203 178.870 17 -7.942 0.401 157.230 14.751 5.465 -30.410 -34.558 0.019 66.320 -19.273 0.109 130.040 18 -8.189 0.390 78.110 14.623 5.384 -106.690 -33.641 0.021 -9.190 -18.342 0.121 123.910 19 -10.225 0.308 0.470 14.727 5.449 176.060 -32.688 0.023 -89.470 -14.080 0.198 64.290 20 -12.340 0.242 -79.400 15.088 5.680 97.170 -31.995 0.025 -167.210 -12.706 0.232 -25.240 21 -13.992 0.200 -167.590 14.916 5.570 14.300 -30.988 0.028 111.200 -13.899 0.202 -148.040 22 -13.705 0.206 115.700 14.032 5.030 -64.320 -30.770 0.029 30.820 -14.245 0.194 64.620 23 -10.932 0.284 36.140 13.956 4.986 -137.590 -30.052 0.031 -44.140 -12.565 0.235 -29.680 24 -9.671 0.328 -37.330 14.892 5.554 146.220 -30.344 0.030 -115.840 -12.021 0.251 -122.900 25 -9.069 0.352 -118.940 14.529 5.327 69.630 -29.491 0.034 169.820 -15.400 0.170 146.520 26 -10.111 0.312 133.920 15.764 6.140 -10.430 -28.633 0.037 87.000 -30.816 0.029 95.370 27 -11.661 0.261 25.300 16.279 6.515 -97.400 -28.601 0.037 10.560 -13.237 0.218 111.780 28 -11.753 0.258 -53.360 15.868 6.214 -176.310 -28.074 0.040 -69.280 -7.465 0.423 17.340 29 -11.212 0.275 -118.650 15.610 6.032 96.880 -28.302 0.038 -149.580 -7.579 0.418 -83.330 30 -15.324 0.171 125.850 15.777 6.150 11.950 -27.638 0.042 130.670 -18.770 0.115 101.450 31 -21.074 0.088 -36.080 14.830 5.514 -72.680 -27.784 0.041 40.680 -8.175 0.390 -51.180 32 -11.267 0.273 -33.640 14.219 5.140 -150.300 -28.440 0.038 -43.040 -7.147 0.439 -118.200 33 -4.486 0.597 -120.550 14.902 5.561 134.360 -28.513 0.038 -110.990 -9.731 0.326 -172.120 34 -8.316 0.384 156.720 15.145 5.717 43.150 -30.177 0.031 148.930 -18.714 0.116 -148.940 35 -13.961 0.200 76.250 13.772 4.882 -35.700 -31.432 0.027 67.850 -10.162 0.310 153.430 36 -15.198 0.174 -50.950 16.011 6.318 -120.610 -28.308 0.038 -21.850 -7.894 0.403 8.390 37 -13.810 0.204 -143.150 15.622 6.041 147.660 -28.977 0.036 -122.710 -6.915 0.451 -135.880 38 -8.901 0.359 179.800 15.907 6.243 58.030 -30.175 0.031 130.050 -10.529 0.298 116.150 39 -4.175 0.618 78.600 17.068 7.135 -38.810 -26.925 0.045 85.060 -12.977 0.225 -45.140 40 -3.037 0.705 -50.850 15.714 6.105 -151.620 -26.470 0.048 -35.600 -19.244 0.109 -120.650 note: 1. s-parameters are measured on r&d evaluation board with 50 ohm traces at input and output. efects of connectors and board traces are included in results.
figure 11. gain and t emperature. figure 12. isolation and t emperature. frequenc y (g hz ) gain (db ) 0 20 10 0 -10 -20 40 5 2 5 3 0 15 10 20 35 5 2 5 3 0 15 10 20 35 s21/25c s21/-40c s21/85c s11/25c s11/-40c s11/85c figure 13. input return loss and t emperature. figure 14. o utput return loss and t emperature. frequenc y (g hz ) return l oss (db ) 0 0 -10 -20 -30 -40 40 figure 15. noise figure and te mperature. figure 16. p1db and t emperature. frequenc y ( ghz ) isola tion (db ) 0 0 -20 -40 -60 -80 40 5 2 5 3 0 15 10 20 35 frequenc y ( ghz ) return l oss (db ) 0 0 -10 -20 -30 -40 40 5 2 5 3 0 15 10 20 35 5 2 5 3 0 15 10 20 35 frequenc y (g hz ) nf (db) 0 10 8 6 4 2 0 40 frequenc y ( ghz ) p1db (dbm ) 0 30 25 20 15 10 5 0 40 5 2 5 3 0 15 10 20 35 s12/25c s12/-40c s12/85c s22/25 c s22/-40c s22/85c nf/25c nf/-40c nf/85c p1db/25c p1db/-40c p1db/85c ammp-5024 typical performance (over temperature, v dd = 7v, i dd = 200ma, zin = zo = 50ohm)
biasing and operation ammp-5024 is biased with a single positive drain supply (vdd) a negative gate supply (vg1) and has a positive control gate supply (vg2). for best overall performance the recommended bias condition for the ammp-5024 is vdd =7v and idd = 200 ma. to achieve this drain current level, vg1 is typically between C2.5 to C3.5v. typically, dc current fow for vg1 is C10 ma. open circuit is the default setting for vg2 when not utilizing gain control. using the simplest form of assembly, the device is capable of delivering fat gain over a 2C40 ghz range. however, this device is designed with dc coupled rf i/o ports, and operation may be extended to lower frequencies (<2 ghz) through the use of of-chip low- frequency extension circuitry and proper external biasing components. with low frequency bias extension it may be used in a variety of time domain applications (through 40 gb/s). when bypass capacitors are connected to the aux pads, the low frequency limit is extended down to the corner frequency determined by the bypass capacitor and the combination of the on-chip 50 ohm load and small de- queing resistor. at this frequency the small signal gain will increase in magnitude and stay at this elevated level down to the point where the caux bypass capacitor acts as an open circuit, efectively rolling of the gain completely. the low frequency limit can be approximated from the following equation: 1 f caux = 2 p caux (ro + r deq ) where: ro is the 50 gate or drain line termination resistor. rdeq is the small series dequeing resistor and 10. caux is the capacitance of the bypass capacitor connected to the aux drain and aux gate pad in farads. with the external bypass capacitors connected to the aux gate and aux drain pads, gain will show a slight increase between 1.0 and 1.5 ghz. this is due to a series combination of caux and the on-chip resistance but is exaggerated by the parasitic inductance (lc) of the bypass capacitor and the inductance of the bond wire (ld). input and output rf ports are dc coupled; therefore, dc decoupling capacitors are required if there are dc paths. (do not attempt to apply bias to these pads.) recommended smt attachment the ammp packaged devices are compatible with high volume surface mount pcb assembly processes. the pcb material and mounting pattern, as defned in the data sheet, optimizes rf performance and is strongly recommended. an electronic drawing of the land pattern is available upon request from avago sales & application engineering. manual assembly 1. follow esd precautions while handling packages. 2. handling should be along the edges with tweezers. 3. recommended attachment is conductive solder paste. please see recommended solder refow profle. conductive epoxy is not recommended. hand soldering is not recommended. 4. apply solder paste using a stencil printer or dot placement. the volume of solder paste will be dependent on pcb and component layout and should be controlled to ensure consistent mechanical and electrical performance. 5. follow solder paste and vendors recommendations when developing a solder refow profle. a standard profle will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. 6. packages have been qualifed to withstand a peak temperature of 260c for 20 seconds. verify that the profle will not expose device beyond these limits. stencil design guidelines a properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the pcb pads. the recommended stencil layout is shown in figure 19. the stencil has a solder paste deposition opening approximately 70% to 90% of the pcb pad. reducing stencil opening can potentially generate more voids underneath. on the other hand, stencil openings larger than 100% will lead to excessive solder paste smear or bridging across the i/o pads. considering the fact that solder paste thickness will directly afect the quality of the solder joint, a good choice is to use a laser cut stencil composed of 0.127 mm (5 mils) thick stainless steel which is capable of producing the required fne stencil outline. the combined pcb and stencil layout is shown in figure 20.
outline drawing figure 17. outline drawing figure 18. suggested pcb material and land pattern figure 19. stencil outline drawing (mm) figure 20. combined pcb and stencil layouts dimensional tolerance for back view: 0.002" [0.05 mm] 1 2 3 7 6 5 3 2 1 5 6 7 a amm p xxxx y wwdnn a 8 4 b 0.114 [2.9] 0.014 [0.365] 0.016 [0.40] 0.012 [0.30] 0.028 [0.70] 0.093 [2.36] 0.016 [0.40] 0.100 [2.54] 0.011 [0.28] 0.018 [0.46] 0.126 [3.2] 0.059 [1.5] 0.100 [2.54] 0.029 [0.75] 4 8 front view symbol a b min 0.198 (5.03) 0.0685 (1.74) max 0.213 (5.4) 0.088 (2.25) side view back view notes: 1. * indicates pin 1 2. dimensions are in inches [millimeters] 3. all grounds must be soldered to pcb rf ground
0 part number ordering information part number devices per container container AMMP-5024-BLKG 10 antistatic bag ammp-5024-tr1g 100 7 reel ammp-5024-tr2g 500 7 reel carrier tape and pocket dimensions device orientation (top view)
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 005-00 avago technologies limited. all rights reserved. av0 -04 5en - june , 00 avago technologies certificate of compliance page 2 format rev 5, 5 july 2007 a a a v v v a a a g g g o o o t t t e e e c c c h h h n n n o o o l l l o o o g g g i i i e e e s s s c c c e e e r r r t t t i i i f f f i i i c c c a a a t t t e e e o o o f f f c c c o o o m m m p p p l l l i i i a a a n n n c c c e e e a a a v v v a a a g g g o o o t t t e e e c c c h h h n n n o o o l l l o o o g g g i i i e e e s s s c c c e e e r r r t t t i i i f f f i i i c c c a a a t t t e e e o o o f f f c c c o o o m m m p p p l l l i i i a a a n n n c c c e e e the part names and contents of the hazardous substances in the electronic information products as shown below. names and contents of the toxic and hazardou s substances or elements in the products {
?y!|y?(=b2?,x /? ? ?g part name toxic and hazardous substances or elements y!|y?(=b2? f? /? lead (pb) j? (pb) mercury (hg) "2 ? hg ? cadmium (cd) k ? cd ? hexavalent (cr(vi)) a? j? cr(vi) ? polybrominated biphenyl (pbb) ? $?6(8?? pbb ? polybrominated diphenylether (pbde) ?$?`8?gn? pbde ? 100pf capacitor 2 | | | | | | : indicates that the content of the toxic and hazardous su bstance in all the homogeneous materials of the part is below the concentration limit requirement as described in sj/t 11363-2006. 2 : indicates that the content of the toxic and hazardous subs tance in at least one homogeneous material of the part exceeds the concentration limit requirement as described in sj/t 11363-2006. (the enterprise may further explain the technical reasons fo r the x indicated portion in the table in accordance with the actual situations.) | ?><' ,xt se> e?!9aa?? for product availability and compliance information, please contact avago distributors or avago sales & marketing via rohs.enquiry-spg@avagotech.com . for product technical information (terminat ion finish, temperature profile, product substance content etc.) please contact: pb-free.spg@avagotech.com . this document further certifies that the materials declar ation provided above by avago technologies is accurate. avago technologies product stewardship malaysian contact: chan gum meng bayan lepas fiz phase 3, 11900 penang, malaysia e-mail: gum-meng.chan@avagotech.com malaysian contact: 604-610-5615 the information presented in this document is believed accurate and reliable. data is the most current available to avago tech nologies at the time of preparation and is issued as a matter of information only. no warranty as to accuracy or completeness is expressed or implied. the inform ation in this document is subject to change without notice. ? copyright avago technologies, 2005. reproduction, adaptation, or translation without prior written p ermission is prohibited except as allowed under copyright laws. note: eu rohs compliant under exemption clause of lead in electronic ceramic parts (e.g. piezoelectronic devices)

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